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★ MIL-STD-883 - military of the united states standards ..



                                     

★ MIL-STD-883

The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations, mechanical and electrical tests, workmanship and training procedures, and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.

                                     

1. Environmental tests, methods 1001-1034. (Экологические тесты, методы 1001-1034)

  • 1023.3 Dose rate response of linear microcircuits.
  • 1021.3 Dose rate upset testing of digital microcircuits.
  • 1012.1 Thermal characteristics. (1012.1 тепловые характеристики)
  • 1022 Mosfet threshold voltage.
  • 1030.2 Preseal burn-in. (1030.2 Preseal ожог-в)
  • 1005.8 Steady-state life. (1005.8 стационарных жизни)
  • 1018.6 Internal gas analysis.
  • 1011.9 Thermal shock. (1011.9 теплового удара)
  • 1016.2 Life / reliability characterization tests.
  • 1002 Immersion. (Погружение 1002)
  • 1017.2 Neutron irradiation. (1017.2 нейтронного облучения)
  • 1020.1 Dose rate induced latchup test procedure.
  • 1015.10 Burn-in test. (1015.10 ожог-в испытании)
  • 1007 Agree life. (1007 согласен жизнь)
  • 1014.13 Seal. (1014.13 печать)
  • 1010.8 Temperature cycling. (Температура 1010.8 велоспорт)
  • 1003 Insulation resistance. (1003 сопротивление изоляции)
  • 1031 Thin film corrosion test.
  • 1008.2 Stabilization bake. (1008.2 стабилизации испечь)
  • 1009.8 Salt atmosphere. (1009.8 соль атмосферу)
  • 1004.7 Moisture resistance. (1004.7 влагостойкость)
  • 1034.1 Die penetrant test.
  • 1013 Dew point. (1013 точка росы)
  • 1032.1 Package induced soft error test procedure.
  • 1033 Endurance life test.
  • 1006 Intermittent life. (1006 перемежающейся жизни)
  • 1019.8 Ionizing radiation total dose test procedure.
  • 1001 Barometric pressure, reduced altitude operation.
                                     

2. Mechanical tests, methods 2001-2036. (Механические испытания, методы 2001-2036)

  • 2006.1 Vibration noise. (Вибрации 2006.1 шума)
  • 2016 Physical dimensions. (2016 физические размеры)
  • 2028.4 Pin grid package destructive lead pull test.
  • 2004.5 Lead integrity. (2004.5 вести целостности)
  • 2026 Random vibration. (2026 случайной вибрации)
  • 2008.1 Visual and mechanical.
  • 2002.3 Mechanical shock. (2002.3 механических ударов)
  • 2025.4 Adhesion of lead finish.
  • 2011.7 Bond strength bond pull test.
  • 2013.1 Internal visual inspection for DPA.
  • 2009.9 External visual. (2009.9 внешних визуальных)
  • 2003.7 Solderability. (2003.7 Паяемости)
  • 2020.7 Particle impact noise detection test PIND.
  • 2027.2 Substrate attach strength.
  • 2015.11 Resistance to solvents.
  • 2017.7 Internal visual hybrid.
  • 2007.2 Vibration, variable frequency.
  • 2005.2 Vibration fatigue. (Вибрации 2005.2 усталость)
  • 2029 Ceramic chip carrier bond strength.
  • 2001.2 Constant acceleration. (2001.2 постоянным ускорением)
  • 2021.3 Glassivation layer integrity.
  • 2010.10 Internal visual monolithic.
  • 2032.1 Visual inspection of passive elements.
  • 2014 Internal visual and mechanical.
  • 2036 Resistance to soldering heat.
  • 2018.3 Scanning electron microscope SEM inspection of metallization.
  • 2012.7 Radiography. (2012.7 рентгенография)
  • 2030 Ultrasonic inspection of die attach.
  • 2022.2 Wetting balance solderability.
  • 2023.5 Nondestructive bond pull.
  • 2035 Ultrasonic inspection of TAB bonds.
  • 2024.2 Lid torque for glass-frit-sealed packages.
  • 2031.1 Flip chip pull-off test.
  • 2019.5 Die shear strength.
                                     

3. Electrical tests digital, methods 3001-3024. (Электрические испытания цифровых методов 3001-3024)

  • 3014 Functional testing. (3014 функциональное тестирование)
  • 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages.
  • 3011.1 Output short circuit current.
  • 3023.1 Static latch-up measurements for digital CMOS microelectronic devices.
  • 3008.1 Breakdown voltage, input or output.
  • 3009.1 Input current, low level.
  • 3022 Input clamp voltage.
  • 3002.1 Load conditions. (3002.1 нагрузках)
  • 3015.8 Electrostatic discharge sensitivity classification.
  • 3024 Simultaneous switching noise measurements for digital microelectronic devices.
  • 3013.1 Noise margin measurements for digital microelectronic devices.
  • 3018 Crosstalk measurements for digital microelectronic device packages.
  • 3010.1 Input current, high level.
  • 3006.1 High level output voltage.
  • 3017 Microelectronics package digital signal transmission.
  • 3007.1 Low level output voltage.
  • 3021 High impedance off-state high-level output leakage current.
  • 3016 Activation time verification.
  • 3003.1 Delay measurements. (3003.1 задержки измерения)
  • 3004.1 Transition time measurements.
  • 3005.1 Power supply current.
  • 3020 High impedance off-state low-level output leakage current.
  • 3001.1 Drive source, dynamic.
  • 3012.1 Terminal capacitance. (3012.1 терминал емкости)


                                     

4. Electrical tests linear, methods 4001-4007. (Электрические испытания линейной, методы 4001-4007)

  • 4007 Automatic gain control range.
  • 4006.1 Power gain and noise figure.
  • 4005.1 Output performance. (Производительность 4005.1)
  • 4001.1 Input offset voltage and current and bias current.
  • 4004.2 Open loop performance.
  • 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio.
  • 4002.1 Phase margin and slew rate measurements.
                                     

5. Test procedures, methods 5001-5013. (Процедуры испытаний, методы 5001-5013)

  • 5008.9 Test procedures for hybrid and multichip microcircuits.
  • 5006 Limit testing. (Лимит 5006 тестирования)
  • 5011.5 Evaluation and acceptance procedures for polymeric adhesives.
  • 5010.4 Test procedures for custom monolithic microcircuits.
  • 5004.11 Screening procedures. (Процедуры скрининга 5004.11)
  • 5003 Failure analysis procedures for microcircuits.
  • 5012.1 Fault coverage measurement for digital microcircuits.
  • 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers.
  • 5005.15 Qualification and quality conformance procedures.
  • 5009.1 Destructive physical analysis.
  • 5007.7 Wafer lot acceptance.
  • 5002.1 Parameter distribution control.
  • 5001 Parameter mean value control.
                                     
  • Impact Noise Detection test. According to method 2020.9 of MIL - STD - 883 and method 2052.5 of MIL - STD - 750, the purpose of a PIND test is to detect loose particles
  • defense standard, often called a military standard, MIL - STD MIL - SPEC or informally Mil Specs is used to help achieve standardization objectives
  • necessary, to eliminate surface skin effects. MIL - STD - 883 2011.9 bond strength bond pull test MIL - STD - 883 method 2031.1 Flip - chip pull - off test BS
  • used is the test model defined in the United States military standard, MIL - STD - 883 Method 3015.9, Electrostatic Discharge Sensitivity Classification. This
  • hybrid technology. The test procedures of these requirements are found in MIL - STD - 883 Test Methods and Procedures for Microelectronics as a listing of test
  • mandatory for manufacturers of device types supplied in compliance with MIL - STD - 883 and forms the basis for QML classes Q and V. Appendix B is intended for
  • and look method is a qualitative test. One form of it is specified as Mil - Std - 883 Method 2003. On the other hand, the wetting balance analysis is a quantitative
  • 3D - PEIM 2016. MIL - STD - 883 Test Method Standard for Microcircuits, Method 2011.7 Bond Strength Destructive Bond Pull Test MIL - STD - 883 Test Method Standard
  • ISO EN 61000 - 4 - 2 needed for the CE mark IEC 61000 - 4 - 2 ISO TR10605 MIL - STD - 883 MIL - STD - 1512 GR - 78 - CORE RTCA DO 160 Test Laboratory Phoenix Testlab. Retrieved


                                     
  • Method: Per Mil - Std - 810G for LRUs and SRUs, per Mil - Std - 202G for electronic piece parts, per Mil - Std - 1540 for space systems, and per Mil - Std - 883 H for microelectronic
  • of the sound - Fast production control - Standards : IPC A610, Mil - Std 883 J - Std - 035, Esa, etc - Parts sorting - Inspection of solder pads, flip - chip
  • picofarad capacitor and a 1, 500 ohm resistor. Other similar standards are MIL - STD - 883 Method 3015, and the ESD Association s ESD STM5.1. For comportment to
  • belt asteroid NGC 188 is an open cluster in the constellation Cepheus MIL - STD - 188 series of U.S. military standards relating to telecommunications United
  • by modernizing the K3 with a side - folding adjustable stock, an integral MIL - STD - 1913 rail on feed cover, detachable side and underside rails, a carbon
  • joint Commercial Aviation Safety Team ICAO Common Taxonomy Team. Standing STD Prior to pushback taxi, after gate arrival, or stationary and parked. Taxi
  • from Computing Devices Co of Canada contains two 32 - bit processors with a MIL STD 1553B databus, and has capacity for additional systems, such as a Battlefield
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  • Home Away B BA BRE B HA BRR CHA COV CRY EXE GIL LUT MER MIL NPC NOR NWC PLY QPR STD SWI TOR WAL WAT Bournemouth Boscombe Athletic 1 0 3 1 4 3 3 1
  • 20 4 6 11 25 36 0.964 36 21 Newcastle United 42 6 11 4 42 29 4 3 14 26 48 0. 883 34 Relegated 22 Sheffield United 42 11 5 5 40 25 1 2 18 18 76 0.574 31
  • 29 55 0.913 40 FA Cup Winners 15 Birmingham 42 8 7 6 37 32 7 3 11 31 45 0. 883 40 16 Huddersfield Town 42 9 6 6 45 23 5 5 11 25 38 1.148 39 17 West Ham

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MIL STD 883 Archives EM Research Full Spectrum Innovation.

The latest Rev of Mil Std 883K includes significant changes to two important Test Methods that contain the visual inspection criteria for Hybrids, Microcircuits and. MIL STD 883 NorCom Systems Inc. A Critical Review of MIL STD 883 Wirebond Visual Inspection Criteria. Speaker: Thomas Green TJ Green Associates LLC, Bethlehem PA 18017. E mail:. MIL STD 883 SAR A D Converters Renesas. Grade pins are hot solder dipped over nickel plating to meet the solderability requirements of MIL STD 883. Method 2003. QML 38534 FACILITY APPROVAL​. New Release of Mil Std 883 Visual Inspection Criteria Circuitnet. Renesas MIL STD 883 compliant analog to digital converters include a digital interface for microprocessor control.





MIL STD 883.

The TONEX MIL STD 750 883 training course is composed of two sectors of theory and practice. The theoretical material is delivered by lectures and then the​. MIL STD and MIL PRF Testing Capabilities APITech. Продолжительность: 3:17. Evaluation of mil std 883 test method 1019.6 for bipolar TI.com. STANDARD: AMPTEK HIGH RELIABILITY SCREENING. Nondestructive Bond Pull 100%, MIL STD 883, Method 2023. Precap Visual:.


MIL STD 883, Method 2012 AcousTech, Inc.

MIL STD 883, entitled Test Methods and. Procedures for Microelectronics, provides the test methods and procedures for the products of a whole new industry. Qualification Test Method and Acceptance Criteria. Orlando, FL, July 28, 2020: A joint test conducted by researchers of the U.S. Air Force Research Laboratory, Oak Ridge National Laboratory,. Custom Power Supplies Microchip Technology. MIL STD 883. 1005. T 125℃. Apply Voltage. ≧1.1Vcc. Dynamic. 77. 0 Acceptable number is upon sample size. For Memory: Target failure rate. 100 FITs at.





Qualification Services MIL STD 883 & JEDEC Screening.

Spetific reference to one or more MIL STD 883 method s on a stand alone basis requires complian to only the specifically referenced method s. Such devices. MIL STD 883 PDF Method. DLA Defense Logistics Agency certified Environmental, Mechanical, and Electrical testing compliant with MIL STD 883, MIL PRF 38535, MIL STD 750,. MIL STD 883 2 Techstreet. Test Description, MIL STD 883. Method, Condition, In House. Salt Spray, 1001. Moisture Resistance, 1002, II. Mechanical Shock, 2004. Barometric Pressure.


MIL STD 883 Testing Lab with Engineering Experts & Short Lead.

Many devices used in Aerospace & Defense applications must be tested to either MIL STD 883 integrated circuits or MIL STD 750 discrete devices. A Critical Review of MIL STD 883 Wirebond Visual Inspection Criteria. The MIL STD 883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic. Upscreening of Class B Microcircuits For Space Texas Instruments. This military standard provides the uniform methods and procedures for testing microelectronic devices for use within military and aerospace. MIL STD 883H INSPECTION REQUIREMENT MIL STD 883. AEROSPACE QUALIFICATION TESTS PER GROUP D, MIL PRF 38535. TEST. MIL STD. 883. CONDITIONS. SAMPLE. SIZE. EXPECTED COMPLETION DATE.


Blackfox: MIL STD 883 Standards for Radiation Blackfox Premier.

The MIL STD 883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and​. MIL STD 883 Test Methods 1004 1018. Have been found to meet the extensive certification requirements of Test Method 5011 in MIL STD 883 for adhesives. Epoxy Technology continues to expand.





MIL Equivalent Screening & Qualification.

MIL STD 883B Data Sheets. Maxim offers a number of hermetic devices fully compliant with MIL STD 883, Rev. H. The table below provides links to both the. MIL STD 883B Data Sheets Maxim Integrated. MIL STD 883 is the US DoD standard for test methods for microcircuits. At more than 700 pages long, it covers a wide range of testing. M and 883 Screening Program Apex Microtechnology. CSM Singapore. Test. Military or Industry. Standard. Conditions. Test. Points. Test Results Comments. Life Test. MIL STD 883. Method 1005. 150oC 3.3V. 168. Vishay Electro Films Testing Capabilities Vishay Electro Films. Condition in MIL STD 883 Test Method 1019 TM019 test condition A did not work for many bipolar linear circuits used in a low dose rate space environment. MIL STD 883 JEDEC. Military Test Method Standard for Microcircuits Radiography.





Environmental Specifications for High Reliability Crystal Oscillators.

THERMAL SHOCK TEST, MIL STD 883H METHOD 1010.8. One of the main levers available for the product development, in order to accelerate the validation​. TESTING MILITARY GRADE MICROCIRCUITS Gemes. MIL STD 883 Microcircuits. Military Testing to MIL STD 810, MIL STD 883, MIL STD MET Labs. MIL STD 883H. INSPECTION REQUIREMENT. MIL STD 883 EVALUATION CRITERIA. External visual. Radiography. Seal. Method 2009.


MIL STD 883 K Additive Manufacturing AM.

Adding Microsemis E Flow to these devices offers additional testing for space applications requiring a screening level beyond the MIL STD 883. DOC200103 Microsemi. Thermal Shock. Per MIL STD 883, Method 1011, Condition A. Vibration. Per MIL ​STD 883, Method 2007, Condition A. Soldering Conditions. 260°C for 10s max. MIL STD 883 ESD Simulator Gun HBM 100pF 1500Ω Network. Actel Corp.s ProASIC Plus FPGAs have passed extensive testing at extreme conditions to achieve compliance with MIL STD 883 Class B and qualify for use in. MIL STD 883 Testing ACT: Advanced Component Testing. MIL STD 883 set the standards for tests for microelectronic devices suitable for use within Military and Aerospace electronic systems. It includes.





Wafer Lot Acceptance to Mil Std 883, Method 2018.

And measurement techniques electrostatic discharge immunity test. MIL STD ​883 Method 5005. Qualification and quality conformance procedures device. MIL STD 883H METHOD 2015.13 18 December 2000 1 METHOD. 716 Pages 2009 7.03 MB 17 Downloads. TEST METHOD STANDARD MICROCIRCUITS MIL STD 883, or invoke it in its entirety as the applicable. Aftermarket MIL STD 883 and MIL PRF 38535 ICs from National. The Mil Std 883, Method 2018 specifies sampling procedures for die selected from the wafers or die already packaged. A sampling of 8 die are required if there is. Candidate spacecraft electronics subjected to ELDRS per Mil Std. MIL STD 883 Class B Screening is shown for comparison purposes only. Only performed when requested by customer. DAICO Class B1. Note 4. MIL STD. SCREENING OPTIONS FOR HYBRIDS STANDARD: AMPTEK. MIL STD 883 1. METHOD 1014.17. 3 May 2018. 1. METHOD 1014.17. SEAL. 1. PURPOSE. The purpose of this test is to determine the effectiveness.


TL 366 - Silicon Turnkey Solutions, Inc. Milpitas, CA The.

November 19, 2019 by Kieley Smith. content uploads​ 2015 10 LT module mount ver3 1896 2376 Kieley Smith. THERMAL SHOCK TEST, MIL STD 883H METHOD 1010.8. Current U.S. MIL STD 883 Test Method 1014 significantly tightens the leak rate requirements for all sizes of hermetic packages, with failure criteria now. MIL STD 883 Experior Laboratories. Mil Std 883 Screen Testing. MIL STD 883 SCREENING OVERVIEW The Department of Defense DoD has set up a quality system to provide device.


VFH3225 CTS Corporation.

2. Standard Level 2 parts as described in EEE INST 002. 3. Vendor Catalog S ​level where applicable. 4. MIL STD 883B parts as approved by the PCB. 5. SCD. MIL STD 883 ESD HBM: Electrostatic Discharge Sensitivity Human. The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device package in sufficient quantity to adversely affect device. Package qualification test results Cypress Semiconductor. Screened to either Class Level B or Class Level S Space Level as defined by MIL STD 883. Method 5004 with Quality Conformance Inspection performed in. Hermetic Cover Seal Process Technology MIL STD 883 TM 1014 Seal. This standard. 1.2 Intended use of or reference to MIL STD 883. When this document is referenced or used in conjunction with the processing and testing of JAN.





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